Engineer, Principal-Packaging
Broadcom Corporation
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San Jose,
CA
-Design and develop custom advanced wirebond and flipchip packages substrate/module with supporting data including characterization, qualification, production readiness, cost effectiveness, and reliability
-Ensure package design follow SI constrains for cross-talk, IR drop, and noise in device. Ensure package solution meet device thermal performance requirement
-Work closely with both silicon desi ... Read More
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