2009-11-21T06:01:30.+01:00Broadcomtag:jobs.broadcom.com,2009-Design and develop custom advanced wirebond and flipchip packages substrate/module with supporting data including characterization, qualification, production readiness, cost effectiveness, and reliability -Ensure package design follow SI constrains for cross-talk, IR drop, and noise in device. Ensure package solution meet device thermal performance requirement -Work closely with both silicon desi2009-10-21T17:20:30.+01:001070783038